BGA Rework Flux

Description

BGA Rework Flux is a specialized flux formulation designed specifically for the precise and challenging process of reworking and repairing BGA components on Printed Circuit Boards (PCBs). With BGA packages, solder balls are arranged in a compact grid pattern under the component, making traditional soldering and rework techniques ineffective. BGA Rework Flux ensures proper wetting, optimal solder joint formation, and minimal residue, all while being compatible with modern reflow and repair processes.

Key Features & Benefits
✅ White to Off-White Colour
The light-colored flux makes it easy to visually inspect during and after rework, ensuring better process control.

✅ No-Clean, Tacky Formulation
The flux residue left after rework is minimal and does not require cleaning, saving time and reducing the risk of damage to sensitive PCB components. Its tacky consistency ensures that the flux stays in place, even when handling fine-pitch BGA components.

✅ High Viscosity & Excellent Wettability
Designed for precision applications, the flux has a high viscosity that allows for accurate application and excellent spreadability. It enhances the solder’s ability to bond to both the BGA pads and the PCB pads, improving reliability.

✅ Suitable for Both Tin-Lead and Lead-Free Applications
Compatible with both traditional Sn-Pb solder systems and modern Lead-Free (SAC alloys) processes, offering flexibility for different manufacturing or repair environments.

✅ Multiple Packaging Options
Available in a variety of pack sizes: 2.5 gm, 5 gm, 10 gm, 100 gm

This makes it ideal for both small repair jobs and larger-scale production or rework operations.

✅ Versatile Applications

Perfectly suited for:

✅  Mobile Phone Repairs
✅  BGA Chip Replacement and Reballing
✅  Component Repositioning on High-Density PCBs
✅  Micro Soldering & Precision Electronics Repair