SMT Red Glue

Description

Electo 4403 one component, fast curing epoxy adhesive. Used for bonding and fixing SMD components on printed circuit boards. The fast curing properties make it particularly suitable for SMT production requirements. Very low hygroscopicity allows the glue to be exposed to the air for a long time without affecting its dispersibility or void formation after curing.

Method of Use

The Red / SMT Glue is stored in refrigerated conditions as described. Stored products must return to the ambient temperature before use. To reach room temperature of 25 Degree C It takes approximately 2-4 Hours for a 30 ml pack and around 4-6 hours for 200-300 ml bottles.

Precautions:

• In order to avoid contamination of unused or partially used glue, never refill to the original packaging.
• Exposure of the glue to air in normal room conditions will make it prone to absorb water from the ambient air and effects the performance.
• While printing on stencil, do not put the printed circuit board in the air for too long. The patch should be cured as soon as possible. If conditions permit, the air humidity

Heat Resistant Solder Impregnate conditions :

According to the IPC SM817 (2.4.421) standard, the product 7103 passed the hot solder  mmersion test. The C-1206 capacitor attached to the FR4 PCB using 7103 was placed on top of the solder pot at 260 ° C for 60 seconds and then immersed in the pot for 10 seconds without any component detachment or displacement.